US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Aug. 26 for "Chip package on package structure, packaging method thereof, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,982, issued on Aug. 26, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Chip package on package structure, packaging method thereof, and electronic device" was invented by Tonglong Zhang (Shenzhen, China), Xiaodong Zhang (Shenzhen, China), Yong Guan (Shanghai) and Simin Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package on package structure includes a primary chip stack unit having pins insulated and spaced from each other on a first surface; a first bonding layer disposed on the first surface, where the first bonding layer includes bonding components insulated and spaced from each other, each bonding comp...