US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Aug. 12 for "Chip package structure and chip packaging method" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,059, issued on Aug. 12, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Chip package structure and chip packaging method" was invented by Tonglong Zhang (Shenzhen, China), Xiaodong Zhang (Shenzhen, China), Yong Guan (Shanghai) and Heng Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure includes a first chip, a second chip, and a carrier board. The first chip is disposed between the second chip and the carrier board. An active layer of the first chip is opposite to an active layer of the second chip. A first interconnection structure is disposed between the first chip and the second chip and is conf...