ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,604, issued on July 29, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China).
"Packaged power semiconductor device and power converter" was invented by Dong Chen (Shanghai), Lei Shi (Shanghai) and Yunfeng Liu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged power semiconductor device includes a power semiconductor wafer, a heat conduction layer, and a heat sink that are sequentially stacked, and a sealing part configured to wrap and seal the power semiconductor wafer and at least part of the heat conduction layer. The packaged power semiconductor device further includes a pin, where the pin includes a conne...