US Patent Issued to HUAWEI DIGITAL POWER TECHNOLOGIES on Dec. 2 for "Packaged device, packaged module, and power conversion device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,413, issued on Dec. 2, was assigned to HUAWEI DIGITAL POWER TECHNOLOGIES Co. LTD. (Shenzhen, China).

"Packaged device, packaged module, and power conversion device" was invented by Dong Chen (Shanghai), Fenglong Lu (Shanghai), Yunyu Tang (Shanghai), Lei Shi (Shanghai), Yunfeng Liu (Shanghai), Shuyi Lv (Shanghai) and Pengcheng Zhang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and...