US Patent Issued to HUAWEI CLOUD COMPUTING TECHNOLOGIES on Oct. 14 for "Industrial defect recognition method and system, computing device, and storage medium" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,038, issued on Oct. 14, was assigned to HUAWEI CLOUD COMPUTING TECHNOLOGIES Co. LTD. (Guizhou, China).

"Industrial defect recognition method and system, computing device, and storage medium" was invented by Xiudong Wang (Beijing), Xin Jin (Beijing) and Dandan Tu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A target region is first extracted from a to-be-recognized image, and then a defect coarse-selection region including an industrial defect is obtained from the target region. Through two times of region extraction, a proportion of a size of the industrial defect to a size of a background is increased, so that a probability of de...