US Patent Issued to HUAIAN AUCKSUN OPTOELECTRONICS TECHNOLOGY on Nov. 11 for "LED chip and preparation method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,414, issued on Nov. 11, was assigned to HUAIAN AUCKSUN OPTOELECTRONICS TECHNOLOGY Co. LTD (Jiangsu, China).

"LED chip and preparation method therefor" was invented by Sibo Wang (Jiangsu, China), Dongmei Li (Jiangsu, China) and Han-Chung Liao (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to the technical field of semiconductor manufacturing, and in particular to an LED chip and a preparation method thereof, including: a substrate, an epitaxial layer, a current blocking layer, a current spreading layer, a first P-type electrode, a first N-type electrode, a first insulation layer, a second P-type electrod...