ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,252, issued on Nov. 11, was assigned to HTC Corp. (Taoyuan, Taiwan).
"Heat dissipation device with communication function" was invented by Ta-Chun Pu (Taoyuan, Taiwan) and Chun-Yih Wu (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device with a communication function includes a conductive substrate, a first conductive sidewall, a plurality of heat sink elements, and a feeding element. The first conductive sidewall and the heat sink elements are respectively coupled to the conductive substrate. The feeding element is coupled to a signal source. An antenna structure is formed by the feeding element, the conductive s...