US Patent Issued to HRL LABORATORIES on Nov. 4 for "Thermal isolation between embedded MECA modules" (California Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,109, issued on Nov. 4, was assigned to HRL LABORATORIES LLC (Malibu, Calif.).

"Thermal isolation between embedded MECA modules" was invented by Florian Herrault (Malibu, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic assembly, having a carrier wafer with a top wafer surface and a bottom wafer surface; an electronic integrated circuit being formed in the carrier wafer and comprising first and second integrated circuit contact pads; said carrier wafer comprising a through-wafer cavity having walls that join said top wafer surface to said bottom wafer surface; first and second component chips held in said through-wafer cavity each b...