ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,047, issued on March 18, was assigned to HRL LABORATORIES LLC (Malibu, Calif.).

"Embedded high-z marker material and process for alignment of multilevel ebeam lithography" was invented by Christopher Bohn (Santa Monica, Calif.), Maxwell Choi (Thousand Oaks, Calif.), Melanie Yajima (Los Angeles), Sieu Ha (Los Angeles), Maggy Lau (Stevenson, Calif.), Clayton Jackson (Los Angeles), Wonill Ha (Thousand Oaks, Calif.) and Matthew Borselli (Calabasas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "One or more embodiments of the present disclosure are directed toward improved methods of fabricating a semiconductor device utilizing multi-level electr...