US Patent Issued to Howmedica Osteonics on April 1 for "Polymer interlock support structure and method of manufacture thereof" (New Jersey, Pennsylvania Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,263,271, issued on April 1, was assigned to Howmedica Osteonics Corp. (Mahwah, N.J.).

"Polymer interlock support structure and method of manufacture thereof" was invented by Reginald Lee (West Chester, Pa.), Philip Harris Frank (Maplewood, N.J.) and Alvin Perez (Ringwood, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An orthopedic implant includes a porous insert having a first insert portion having a first insert thickness and a second insert portion having a second insert thickness. The implant includes a non-metallic structure having a first non-metallic portion having a first non-metallic thickness and a second non-metallic portion having a se...