ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,262, issued on March 25, was assigned to HOSIDEN Corp. (Osaka, Japan).
"Substrate and microphone unit" was invented by Shingo Okano (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a substrate that is highly resistant to ESD, on which a reverse sound hole type MEMS microphone can be mounted. The substrate has one surface connected to a MEMS microphone, and comprises a substrate sound hole that penetrates through the substrate and communicates with a sound hole of the MEMS microphone, and a GND pad disposed around the substrate sound hole on another surface of the substrate."
The patent was filed on May 13...