US Patent Issued to HORIBA STEC on Nov. 4 for "Wafer temperature control device, wafer temperature control method, and wafer temperature control program" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,069, issued on Nov. 4, was assigned to HORIBA STEC Co. Ltd. (Kyoto, Japan).

"Wafer temperature control device, wafer temperature control method, and wafer temperature control program" was invented by Daisuke Hayashi (Kyoto, Japan) and Kotaro Takijiri (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a wafer temperature control device for controlling the temperature of a wafer by regulating the pressure of a heat transfer gas, the wafer temperature control device being capable of estimating the temperature of the wafer with sufficient accuracy and controlling the temperature of the wafer to a target temperature, and...