ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,750, issued on June 10, was assigned to HORIBA STEC Co. Ltd. (Kyoto, Japan).
"Electrostatic chuck device, pressure calculation method and program" was invented by Lei Ma (Kyoto, Japan), Andrew Price (Kyoto, Japan) and Tadahiro Yasuda (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck device for adsorbing an object by electrostatic force comprises an adsorption plate that has an adsorption surface to adsorb the object, a gas supplying line that supplies a thermally conductive gas to a gap between the adsorption surface and an adsorbed surface of the object and a pressure calculation section that calculates the pressur...