ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,220,672, issued on Feb. 11, was assigned to HORIBA STEC Co. Ltd. (Kyoto, Japan).
"Liquid material vaporizing device" was invented by Hidetaka Yada (Kyoto, Japan), Soichiro Hirai (Kyoto, Japan) and Akira Matsuura (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a liquid material vaporizing device that heats a liquid material supplying pipe without providing a heating mechanism, the liquid material vaporizing device including: a gas-liquid mixer unit configured to mix a liquid material and a gas to generate a gas-liquid mixture; a liquid material supplying pipe configured to supply the liquid material to the gas-liquid...