US Patent Issued to HORIBA on Feb. 3 for "Semiconductor laser device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,415, issued on Feb. 3, was assigned to HORIBA LTD. (Japan).

"Semiconductor laser device" was invented by Yusuke Awane (Kyoto, Japan), Makoto Matsuhama (Kyoto, Japan), Kosuke Tsukatani (Kyoto, Japan), Kodai Niina (Kyoto, Japan) and Takuya Ido (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To suppress individual differences in intensity of output laser light for each semiconductor laser device as much as possible while suppressing generation of stray light in a package of the semiconductor laser device, provided is a semiconductor laser device used for optical analysis, including: a package that accommodates a semiconductor laser element ...