US Patent Issued to HONOR DEVICE on Oct. 7 for "Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,555, issued on Oct. 7, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic device" was invented by Zhiqiang Wang (Shenzhen, China), Hanghang Dong (Shenzhen, China), Xiaofeng Hu (Shenzhen, China) and Junjie Yang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application provides a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method includes: placing a substrate having an electronic element in an environment that me...