ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,452,354, issued on Oct. 21, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).
"Electronic device and electronic device assembly method" was invented by Ke Ding (Shenzhen, China), Baojun Gao (Shenzhen, China) and Kuibing Zhao (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device and an electronic device assembly method. A through hole is provided in a rear cover. An inner wall of the through hole protrudes to form an annular flange. A camera decorative member is designed to include an inner decorative member and an outer decorative member. The outer decorative member is arranged on a side of the rear cover facing awa...