US Patent Issued to Honor Device on Nov. 18 for "Support assembly, display module, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,672, issued on Nov. 18, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Support assembly, display module, and electronic device" was invented by Yujun Zhang (Shenzhen, China) and Ning Guo (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A support assembly includes a support plate, a first adhesive layer, a substrate, and a second adhesive layer. The support plate, the first adhesive layer, the substrate, and the second adhesive layer are stacked from the bottom up. The substrate is attached to the support plate by using the first adhesive layer, and the support assembly is configured to attach to another structure by using t...