US Patent Issued to HONOR DEVICE on Nov. 18 for "Arrangement of two secondary circuit boards within an electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,666, issued on Nov. 18, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Arrangement of two secondary circuit boards within an electronic device" was invented by Kangle Xue (Shenzhen, China), Jiuliang Gao (Shenzhen, China), Lijun Yang (Shenzhen, China) and Baojun Gao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic assembly includes a first electronic component, a second electronic component, and a primary circuit board. The first electronic component is provided with a first secondary circuit board, the second electronic component is provided with a second secondary circuit board, the first secondary circuit bo...