US Patent Issued to HONOR DEVICE on May 27 for "Package body, preparation method thereof, terminal, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,464, issued on May 27, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Package body, preparation method thereof, terminal, and electronic device" was invented by Le Zhang (Shenzhen, China), Xueping Guo (Shenzhen, China) and Huijuan Wang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package body includes: a substrate; a plurality of electronic components, arranged on the substrate; a package material layer, located on the substrate and packaging the plurality of electronic components; a low frequency shielding conductive structure, embedded in the package material layer, where the low frequency shielding conductive struc...