US Patent Issued to Honor Device on May 20 for "Circuit board assembly soldering apparatus and circuit board assembly soldering method" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,303,990, issued on May 20, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Circuit board assembly soldering apparatus and circuit board assembly soldering method" was invented by Jianqiang Guo (Shenzhen, China), Wenjun Luo (Shenzhen, China) and Mingchuan Li (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the work...