US Patent Issued to Honor Device on March 18 for "Shielding case, circuit board assembly, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,526, issued on March 18, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Shielding case, circuit board assembly, and electronic device" was invented by Jiuliang Gao (Shenzhen, China) and Yihe Zhang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A shielding case includes a case body. The case body and the circuit board enclose a shielded region, and at least part of elements on the circuit board are capped inside the shielding case. The elements located inside the case body include a first component, where the first component has a step surface facing the case body. A reinforcing part is provided in a region on the case bo...