US Patent Issued to HONOR DEVICE on June 10 for "Cover body structure, back cover, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,407, issued on June 10, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Cover body structure, back cover, and electronic device" was invented by Yang Liu (Shenzhen, China), Lei Feng (Shenzhen, China), Wei Zhang (Shenzhen, China) and Wenxing Yao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cover body structure, a back cover, and an electronic device are provided, related to the field of electronic device technologies. The cover body structure includes a glass cover plate, a first ink layer, a first glue layer, and a plastic edge portion. The first ink layer is disposed at least on an edge of the glass cover plate. The f...