US Patent Issued to HONOR DEVICE on July 8 for "Electronic component connecting structure and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,139, issued on July 8, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Electronic component connecting structure and electronic device" was invented by Yan Wang (Shenzhen, China), Jiuliang Gao (Shenzhen, China), Yan Lv (Shenzhen, China), Yunchun Huang (Shenzhen, China) and Sen Yang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An connecting structure includes a connecting board, a first component connecting to one side of the connecting board; and a second component connecting to the other side of the connecting board. A perpendicular projection of the first component on a preset plane overlaps a perpendicular projection o...