US Patent Issued to HONOR DEVICE on July 22 for "Receiving module, packaging structure, printed circuit board, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,412, issued on July 22, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Receiving module, packaging structure, printed circuit board, and electronic device" was invented by Tong Wang (Shenzhen, China) and Qinghua Huang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application provides a receiving module, a packaging structure, a printed circuit board, and an electronic device, which can mitigate a problem that application scenarios of a front-end receiving module of an existing GNSS receiver are limited. The receiving module includes a first filtering unit, an amplifying unit, and a control element. When the amplifyi...