ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,288, issued on July 22, was assigned to Honor Device Co. Ltd. (Shenzhen, China).
"Circuit board assembly and electronic device" was invented by Jianqiang Guo (Shenzhen, China), Wenjun Luo (Shenzhen, China) and Jun Li (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided ...