US Patent Issued to Honor Device on July 15 for "Detection method and detection device for detecting concentration of solder flux in reflow oven" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,360,040, issued on July 15, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Detection method and detection device for detecting concentration of solder flux in reflow oven" was invented by Ye Lv (Shenzhen, China) and Xiujuan Yang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate is placed in a reflow oven, where a solder flux volatilized in the reflow oven is capable of adhering to a surface of the substrate to form a solder flux layer, a thickness of the solder flux layer is detected, and a concentration of the solder flux in the reflow oven is calculated based on the thickness of the solder flux layer."

The patent ...