US Patent Issued to HONOR DEVICE on July 15 for "Damping assembly, rotating mechanism, and foldable terminal" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,485, issued on July 15, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Damping assembly, rotating mechanism, and foldable terminal" was invented by Yameng Wei (Shenzhen, China), Lei Feng (Shenzhen, China), Wenxing Yao (Shenzhen, China) and Wei Zhang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this application provide a damping assembly, a rotating mechanism, and a foldable terminal. The damping assembly has a simple structure and occupies a relatively small space, which is conductive to a lightening and thinning design of a foldable terminal. The damping assembly includes a damping section and a shaft sl...