US Patent Issued to HONOR DEVICE on Jan. 13 for "Mark hole positioning method and apparatus, assembly device, and storage medium" (Chinese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,871, issued on Jan. 13, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Mark hole positioning method and apparatus, assembly device, and storage medium" was invented by Xi Cheng (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mark hole positioning method is provided. The assembly device obtains a target image including a to-be-positioned mark hole, and extracts contour points of the mark hole from the target image. Next, the assembly device generates a circle center set of auxiliary circles by using the contour points as circle centers of the auxiliary circles. Then, the assembly device traverses each circle center in the...