US Patent Issued to HONOR DEVICE on Feb. 3 for "Integrally formed foldable mechanism and foldable terminal" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,839, issued on Feb. 3, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Integrally formed foldable mechanism and foldable terminal" was invented by Shaohong Dong (Shenzhen, China), Ruihao Chen (Shenzhen, China), Shuai Su (Shenzhen, China), Gaofeng Peng (Shenzhen, China) and Kaifang Jin (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A foldable mechanism and a foldable terminal. The foldable terminal includes the foldable mechanism. The foldable mechanism is conducive to a lightweight design of the foldable terminal. The foldable mechanism includes a base and a pressing plate assembly. The pressing plate assembly is mounted on...