US Patent Issued to Hong Kong Applied Science and Technology Research Institute on Jan. 20 for "Co-electroplating Sn-Bi alloy solder for 3D-IC low-temperature bonding" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,159, issued on Jan. 20, was assigned to Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong, Hong Kong).

"Co-electroplating Sn-Bi alloy solder for 3D-IC low-temperature bonding" was invented by Minjie Xu (Hong Kong, Hong Kong), Xunqing Shi (Hong Kong, Hong Kong), Pau Yee Lim (Hong Kong, Hong Kong) and Tsz Fung Au (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "Reagents A, B, C are added to an electrolyte bath for co-depositing tin-bismuth alloys (Sn-Bi). Reagent A is a larger acid molecule that binds to Bi3+ ions while reagent B is a small molecule that binds to the Bi3+ ions in spaces between the rea...