US Patent Issued to Honeywell Federal Manufacturing & Technologies on Sept. 30 for "Solder preform assembly and methods of preforming solder for electronic board assembly" (Missouri, Kansas Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,863, issued on Sept. 30, was assigned to Honeywell Federal Manufacturing & Technologies LLC (Kansas City, Mo.).

"Solder preform assembly and methods of preforming solder for electronic board assembly" was invented by Timothy Mark Force Jr. (Raymore, Mo.), Lucas Alan Mann (Lee's Summit, Mo.) and Bryan Alan Hildreth (Gardner, Kan.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for preforming solder on electrical components and completing solder joints between the electrical components and electronic boards are disclosed. In some embodiments, a preload assembly is provided. The preload assembly comprises a base configured with a ba...