ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,510, issued on Sept. 9, was assigned to Honda Motor Co. Ltd. (Tokyo).
"Bonding device" was invented by Akiyoshi Miyawaki (Saitama, Japan), Taichi Kurihara (Tokyo) and Yuto Ike (Saitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding device is used to bond a plate assembly including a first plate and a second plate and includes an anvil, a probe, a shoulder component, a driving mechanism, a power supply, and a control part. The anvil is configured to support a first surface of the plate assembly provided by the first plate. The probe is disposed at a position corresponding to the anvil to be opposite to a second surface of the plate ...