US Patent Issued to Honda Motor on Oct. 21 for "Wrap device for modular panel system and wrapping method" (Japanese, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,446,680, issued on Oct. 21, was assigned to Honda Motor Co. Ltd. (Tokyo).

"Wrap device for modular panel system and wrapping method" was invented by Geemay Chia (Pasadena, Calif.), Satoshi Hayashi (Wako, Japan), So Nakaura (Wako, Japan) and Ju-Chia Lee (Pasadena, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wrap device and wrapping for a modular panel system includes a flexible wrap material adapted to securely wrap stacked panels of the modular panel system for securing and carrying the panels. The flexible wrap material member includes at least two strap attachment features and at least one strap adapted to selectively couple to the at leas...