US Patent Issued to HONDA MOTOR on March 18 for "Conductor forming apparatus and conductor forming method" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,506, issued on March 18, was assigned to HONDA MOTOR Co. LTD (Tokyo).

"Conductor forming apparatus and conductor forming method" was invented by Mikito Saito (Tokyo) and Ryosuke Fukuchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conductor forming apparatus that forms a wave winding coil group by folding a conductor, in which the conductor forming apparatus includes: a folding jig that is arranged on an inside of a folding direction of the conductor, the folding jig including a support plate with a tip serving as a starting point for folding the conductor, and a plurality of guide protrusions arranged on a side of the tip of the support...