ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,570, issued on July 15, was assigned to Honda Motor Co. Ltd. (Tokyo).
"Movable spoiler device" was invented by Yuki Nakamura (Tokyo), Kei Ambo (Tokyo) and Kenichi Ando (Saitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A movable spoiler device includes a fixed plate fixed on a vehicle body of a vehicle; a movable plate arranged to be movable between a storing position and an unfolding position closer to the rear than the storing position; a link mechanism provided with one end pivotally supported on the fixed plate and the other end pivotally supported on the movable plate; an electrical component arranged in the vicinity of the movable ...