ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,278, issued on Oct. 14, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei, Taiwan).
"Semiconductor device and the manufacturing method thereof" was invented by Yun-Hung Shen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, a plurality of epitaxial structures and a plurality of gate structures. The substrate includes a plurality of recesses and a plurality of convex portions. Each of the convex portions is located between the two adjacent recesses, in which each of a sidewall of the recesses includes at least two concave portions. Each of the concave portions includes a first i...