US Patent Issued to Holcim Technology on May 20 for "Process for encapsulating fragile insulation materials within polyisocyanurate" (Tennessee, Indiana Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,385, issued on May 20, was assigned to Holcim Technology Ltd (Zug, Switzerland).

"Process for encapsulating fragile insulation materials within polyisocyanurate" was invented by John B Letts (Carmel, Ind.) and Michael J. Hubbard (Murfreesboro, Tenn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present invention are based, at least in part, on the discovery of methods for encapsulating fragile insulation materials within polyisocyanurate foam to thereby provide a construction board having an advantageous balance of insulating properties and mechanical durability."

The patent was filed on March 6, 2020, under Application No. 16/8...