ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,299, issued on Jan. 20, was assigned to HITHIUM TECH HK Ltd. (Kowloon, Hong Kong).
"Method for manufacturing a top cover assembly" was invented by Jinyun Liang (Fujian, China), Liangliang Zhang (Fujian, China), Wancai Zhang (Fujian, China) and Ming Yang (Fujian, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a top cover assembly, a top cover assembly and an energy storage device are provided. The method includes: providing a top cover plate, which is provided with an outlet hole; placing an electrode terminal above one side of the top cover plate to cover the outlet hole, so that a first space is defined between the t...