ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,100, issued on Nov. 4, was assigned to HITACHI POWER SEMICONDUCTOR DEVICE LTD. (Ibaraki, Japan).
"Semiconductor module" was invented by Kisho Ashida (Tokyo), Daisuke Kawase (Hitachi, Japan) and Koji Sasaki (Hitachi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor module comprising a power semiconductor chip, a base, an insulating substrate bonded to the base, a semiconductor chip bonded to the insulating substrate, and a case adhered to the base by means of an adhesive. The semiconductor module has a low variability but a high assembly quality and reliability enabling a decrease in stress between the case and an adher...