US Patent Issued to HITACHI POWER SEMICONDUCTOR DEVICE on June 24 for "Energization inspection apparatus, method for manufacturing semiconductor device, and energization method" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,309, issued on June 24, was assigned to HITACHI POWER SEMICONDUCTOR DEVICE LTD. (Ibaraki, Japan).

"Energization inspection apparatus, method for manufacturing semiconductor device, and energization method" was invented by Masakazu Sagawa (Tokyo), Kumiko Konishi (Tokyo), Hiroshi Miki (Tokyo) and Yuki Mori (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electric connection inspection device includes: a cooling plate; an insulating plate provided on the cooling plate; a first measurement electrode provided on the insulating plate; and a second measurement electrode and a third measurement electrode provided above the first measurement electrod...