US Patent Issued to HITACHI on Sept. 23 for "Printed wiring board and information processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,160, issued on Sept. 23, was assigned to HITACHI LTD. (Tokyo).

"Printed wiring board and information processing apparatus" was invented by Goro Hamamoto (Tokyo), Keisuke Yamamoto (Tokyo), Yutaka Uematsu (Tokyo), Shinsuke Onoe (Tokyo) and Yohei Oshima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the fir...