US Patent Issued to Hitachi High-Tech on Oct. 7 for "Plasma processing apparatus and plasma processing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,968, issued on Oct. 7, was assigned to Hitachi High-Tech Corp. (Tokyo).

"Plasma processing apparatus and plasma processing method" was invented by Takayuki Tokunaga (Tokyo), Mitsuhiro Jomura (Tokyo) and Michikazu Morimoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma processing apparatus including a processing chamber; a first radio frequency power supply configured to supply, to a sample stage on which the sample is placed, a first radio frequency power; a second radio frequency power supply configured to supply, to the sample stage, a second radio frequency power having a frequency higher than a frequency of the first radio frequen...