ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,581, issued on Oct. 14, was assigned to HITACHI HIGH-TECH Corp. (Tokyo).
"Plasma processing apparatus" was invented by Taku Iwase (Tokyo), Masakazu Isozaki (Tokyo), Kenetsu Yokogawa (Tokyo), Masahito Mori (Tokyo) and Junichi Sayama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "In order to be able to independently control a plasma density distribution both in a distribution with high center and a nodal distribution, and perform a plasma processing on a sample with higher accuracy for processing uniformity, a plasma processing apparatus includes: a vacuum vessel in which a plasma processing is performed on a sample; a radio frequency power sou...