US Patent Issued to Hitachi High-Tech on June 3 for "Dimension measurement apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing system" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,320,630, issued on June 3, was assigned to Hitachi High-Tech Corp. (Tokyo).

"Dimension measurement apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing system" was invented by Pushe Zhao (Tokyo), Takeshi Ohmori (Tokyo) and Yutaka Okuyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dimension measurement apparatus that automatically corrects a deviation of a contour without operator determination. The dimension measurement apparatus includes: a model learning unit that obtains a learning cross-sectional image and learning labels attached to different regions of the learning cross-sectional image and generates...