US Patent Issued to Hitachi High-Tech on July 29 for "Semiconductor manufacturing apparatus and semiconductor manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,567, issued on July 29, was assigned to Hitachi High-Tech Corp. (Tokyo).

"Semiconductor manufacturing apparatus and semiconductor manufacturing method" was invented by Masaki Yamada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an etching apparatus or an etching method which improves a processing yield in etching a film formed of SiO2. As means therefor, a semiconductor manufacturing apparatus, which includes an introduction port through which a processing gas containing respective vapors of hydrogen fluoride and an alcohol is introduced into a processing chamber inside a processing vessel, a sample table which is arranged in the...