US Patent Issued to HITACHI HIGH-TECH on Jan. 13 for "Plasma processing apparatus, data analysis apparatus, and semiconductor device manufacturing system" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,442, issued on Jan. 13, was assigned to HITACHI HIGH-TECH Corp. (Tokyo).

"Plasma processing apparatus, data analysis apparatus, and semiconductor device manufacturing system" was invented by Shunta Nosaka (Tokyo), Daisuke Shiraishi (Tokyo) and Akira Kagoshima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a plasma processing apparatus, a data analysis apparatus, and a semiconductor device manufacturing system, capable of assigning an appropriate chemical element or molecule on the basis of the features of a peak shape and capable of performing wavelength identification with high accuracy. The plasma processing apparatus includes: ...