ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,723, issued on Aug. 19, was assigned to Hitachi High-Tech Corp. (Tokyo).
"Alignment device and alignment method" was invented by Shohei Hamada (Tokyo), Hidetoshi Nishiyama (Tokyo) and Atsushi Miki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "This alignment device aligns a stage 10 and a wafer 50 by comparing alignment images captured by respective two chips of the wafer 50 on the stage 10. The alignment device comprises: the stage 10 that holds the wafer 50; an alignment illumination light source 60 that irradiates the wafer 50 held on the stage 10 with light; an alignment a image processing unit 67 that receives light from the wafer 50 and...