US Patent Issued to Hitachi Energy on Oct. 14 for "Power module comprising a semiconductor module component and an alignment part, and method for forming the power module" (Swiss Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,692, issued on Oct. 14, was assigned to Hitachi Energy Ltd (Zurich, Switzerland).

"Power module comprising a semiconductor module component and an alignment part, and method for forming the power module" was invented by Dominik Truessel (Bremgarten, Switzerland), Milad Maleki (Untersiggenthal, Switzerland), Fabian Fischer (Baden, Switzerland) and Lluis Santolaria (Olten, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module having an alignment part fixed on a lateral top surface (10T) of a semiconductor module component. The semiconductor module component has at least one terminal which-at least in places-is orientated vertically...