US Patent Issued to HITACHI ENERGY on Dec. 30 for "Electrical contact arrangement, power semiconductor module, method for manufacturing an electrical contact arrangement and method for manufacturing a power semiconductor module" (Swiss, Finnish Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,413, issued on Dec. 30, was assigned to HITACHI ENERGY LTD (Zurich).

"Electrical contact arrangement, power semiconductor module, method for manufacturing an electrical contact arrangement and method for manufacturing a power semiconductor module" was invented by Juergen Schuderer (Zurich), Fabian Mohn (Ennetbaden, Switzerland), Chunlei Liu (Oberrohrdorf, Switzerland) and Joonas Puukko (Tuusula, Finland).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrical contact arrangement electrically contacts at least two power semiconductor devices, and comprises at least two bond wires and at least three electrical contacts, comprising an alternating c...